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25th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)

Yas Viceroy, Yas Island, Abu Dhabi, UAE

VLSI-SoC Silver Jubilee

 

http://vlsisoc2017.ozyegin.edu.tr

Conference Theme: “The Internet of Things: SoC Opportunities and Challenges

The IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC 2017) is the 25th in a series of international conferences sponsored by the International Federation for Information Processing Technical Committee (IFIP TC) 10 Working Group 5, the Institute of Electrical and Electronics Engineers (IEEE) Council on Electronic Design Automation (CEDA) and the IEEE Circuits and Systems Society (CASS), which explore the state-of-the-art in the areas of Very Large Scale Integration (VLSI) and System-on-Chip (SoC) design. VLSI-SoC 2017 is held under the broad theme: “The Internet of Things: SoC Opportunities and Challenges.”

Previous conferences have taken place in Edinburgh, Trondheim, Tokyo, Vancouver, Munich, Grenoble, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice, Atlanta, Rhodes, Florianópolis, Madrid, Hong Kong, Santa Cruz, Istanbul, Playa del Carmen, Daejeon, and Tallinn.The purpose of VLSI-SoC is to provide a forum to exchange ideas and showcase academic as well as industrial research in architectures, circuits, devices, design automation, verification, test, and security, within digital, analog, and mixed-signal systems.

VLSI-SoC 2017 will be held from October 23, 2017, until October 25, 2017, on Yas Island in the city of Abu Dhabi, capital of the United Arab Emirates, home of the Etihad Airways Formula One Grand Prix, and a major political, economic, and cultural center on the Arabian Gulf.

Research topics of interest include, but are not limited to, the following:

  1. Analog, mixed-signal and sensor architectures
  2. Digital architectures: NoC, multi-core, and reconfigurable
  3. CAD: Synthesis and analysis
  4. Prototyping, verification, modeling, and simulation
  5. Circuits and systems for signal processing and communications
  6. Embedded systems: Architecture, design, and software
  7. Low-power and thermal-aware IC design
  8. Emerging semiconductor technologies
  9. Variability, reliability, and test
  10. Hardware security

Paper Submissions:

Papers should present original research and industrial results not published or submitted for publication in other forums. Electronic submission in PDF format to the EasyChair VLSI-SoC 2017 website is required. The proceedings will be submitted to IEEE for inclusion in IEEE Xplore. A selection of the conference best papers will be invited to submit an extended version to be included as chapters of a book to be published by Springer.

Key Dates:

Abstract Submission: 26 April 2017
Paper Submission: 3 May 2017
Special Session Proposal: 3 May 2017
Notification of Acceptance: 26 June 2017
Camera-ready: 27 July 2017

PhD Forum
VLSI-SoC 2017’s PhD Forum is a poster session aimed at the exchange of ideas and experiences of PhD students from different parts of the world. Selected PhD students have an opportunity to discuss their thesis and research work with specialists within the system and design automation communities. Thus, PhD students receive valuable feedback and gain exposure in the jobs market. Additionally, this forum provides a great opportunity for industry professionals to meet and network with junior researchers.

Best PhD Forum Presentation Award

The PhD Forum Selection Committee will review all presented posters and recommend one poster for the Best PhD Forum Presentation Award.

PhD Forum Chairs

             • Soha Hassoun, Tufts University, USA

             • Leila Ismail, UAE University, UAE

 

Organizing Committees

General Chairs
Ibrahim (Abe) M. Elfadel, Masdar Institute of Science and Technology, UAE
H. Fatih Ugurdag, Ozyegin University, Turkey

Program Chairs
Mihalis Maniatakos, NYU Abu Dhabi, UAE
Matteo Sonza Reorda, Politecnico di Torino, Italy

Special Session Chairs
Mehdi Tahoori, Karlsruhe Institute of Technology, Germany
Youngsoo Shin, Korea Advanced Institute of Science and Technology, Korea

PhD Forum Chairs
Soha Hassoun, Tufts University, USA
Leila Ismail, UAE University, UAE

Academia Liaison
Mohammed Ismail,Wayne State University, USA

Industry Liaisons
Rafic Makki, Mubadala, UAE
Yervant Zorian, Synopsys, USA

Government Liaison
Hazem Al Assaly, Abu Dhabi Education Council, UAE

International Liaisons
Hazem ElTahawy, Mentor Graphics,Egypt
Anton Klotz, Cadence,Germany
Vazgen Melikyan, Synopsys, Armenia

Publication Chairs
Jerald Yoo, Masdar Institute of Science and Technology, UAE
Jose Monteiro, INESC, Portugal

Finance/Local Arrangement Chair
Ibrahim (Abe) M. Elfadel, Masdar Institute of Science and Technology, UAE

Publicity Chairs
Ricardo Reis, UFRGS, Brazil
Masahiro Fujita, Tokyo University, Japan

Registration Chair
Mihai Sanduleanu, Masdar Institute of Science and Technology, UAE

Web Chair
Andreas Henschel, Masdar Institute of Science and Technology, UAE

 

Program Committee


Program Chairs
Mihalis Maniatakos, NYU Abu Dhabi, UAE
Matteo Sonza Reorda, Politecnico di Torino, Italy

Track Co-chairs

             • Analog, mixed-signal and sensor architectures

                           • Mihai Sanduleanu (Masdar Institute, UAE)

                           • Jerzy Dabrowski (Linkoping, Sweden)

             • Digital architectures: NoC, multi-core, and reconfigurable

                           • Haris Javaid (Google, Inc., USA)

                           • Michael Huebner (Ruhr-Universitat Bochum, Germany)

             • CAD: Synthesis and analysis

                           • Ricardo Reis (UFRGS, Brezil)

                           • Matthew Guthaus (UC Santa Cruz, USA)

             • Prototyping, verification, modeling, and simulation

                           • Graziano Pravadelli (U. di Verona, Italy)

                           • Sameh Asaad (IBM, USA)

             • Circuits and systems for signal processing and communications

                           • Luc Claesen (U. Hasselt, Belgium)

                           • Tobias Noll (RWTH Aaachen, Germany)

             • Embedded systems: Architecture, design, and software

                           • Zebo Peng (Linkoping, Sweden)

                           • Vijaykrishnan Narayanan (Penn State, USA)

             • Low-power and thermal-aware IC design

                           • Alberto Macii (Politecnico di Torino, Italy)

                           • Sherief Reda (Brown U., USA)

             • Emerging semiconductor technologies

                           • Andrea Calimera (Politecnico di Torino, Italy)

                           • Aida Todri-Sanial (LIRMM, France)

             • Variability, reliability, and test

                           • Erik Larsson (Lund U., Sweden)

                           • Bernd Becker (Albert-Ludwigs-University, Germany)

             • Hardware security

                           • JV Rajendran (UT Dallas, USA)

                           • Georg Sigl (TU Munich, Germany)

 

 


Sponsors:

IFIP WG10.5

IEEE Circuits and Systems Society

IEEE CEDA

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